Endress+Hauser’s iTHERM SurfaceLine TM611 non-invasive temperature measurement performs comparably to traditional industrial thermometers with an elegant mechanical innovation
As computing workloads grow increasingly dense, hyperscale data centers are transitioning from air-based to liquid cooling solutions. Driven by advancements in high performance computing (HPC) and AI workloads, liquid cooling offers excellent thermal efficiency for modern hardware, such as GPUs and high-density CPUs. Air cooling struggles with thermal management in densely packed environments, leading to hotspots and reduced efficiency.
This white paper explores the challenges of reducing complexity in data center cooling temperature measurements and how modern instrumentation, like Endress+Hauser’s iTHERM SurfaceLine TM611, can enhance related processes.
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